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Re: Yes Cost.?

DDIC Packaging and Testing

Hi

We have released a report on the latest DDIC Packaging and Testing Research Reports. Free sample can be sent for your reference if you need. The possible impact of the recently introduced US tariff policy on the DDIC Packaging and Testing industry will also be analyzed in this report.

Some of the prominent player include:
Steco(Samsung)
LB-Lusem(LG)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co., Ltd..
Jiangsu nepes Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co., Ltd.
ASE Group
Union Semiconductor (Hefei) Co., Ltd.
……


by Type
8-inch Wafer Packaging and Testing
12-inch Wafer Packaging and Testing

by Application
TVs & Displays
Laptops & Tablets
Mobile Phones
Smart Wearables
In-Vehicle Displays

Best regards / Mit freundlichen Grüßen / 此致敬意,
Victoria


por "Amos" <amos@vicglobalintelligence.com> - 02:28 - 25 ago 2025